Introduction
Our research covers all aspects of VLSI physical design (PD) (partitioning, floorplanning, placement, routing, and post-layout optimization), heterogeneous integration (advanced packaging & PCB), design for manufacturing for nanometer ICs, and AI for EDA & EDA for AI. Currently, we are executing 9 research projects, including 6 from industry (advanced packaging, PCB layouts, physical design for nanometer ICs, machine learning for physical design), and 4 from NSC (advanced packaging, machine-learning-based physical design, PCB design). Our lab maintains a collection of over 400 books for research in electronic design automation, one of the most complete collections in this area. The lab is equipped with over 40+ GPUs/CPUs in servers. Each member is also equipped with at least one laptop and one desktop computer for research. The lab has been publishing the most papers at DAC + ICCAD.
Yao-Wen Chang
* 2025 ICCAD Best Paper Award (#1 out of 1058 submissions)
* 2025/2026 Chair, IEEE Fellow Search Committee, IEEE CEDA
* 2022/2023/2024 IEEE Robert N. Noyce Award Selection Committee (a.k.a. the Nobel Prize in Semiconductors)
* 2020/2021 President, IEEE Council on EDA (CEDA)
* 2012/2019 Secretary/VP/President-elect, IEEE CEDA
* 2013/2014 ICCAD Technical Program Chair / General Chair
* 2010/2011/2012 ISPD Technical Program Chair / General Chair / Steering Committee Chair
* 2017 DAC Best Paper Award
* 2013 Four DAC Research Awards (1st Most Papers in the 5th Decade, etc.)
* 101 papers in DAC (#1 worldwide), 81 papers in ICCAD (#2 worldwide), 88 papers in TCAD (#3)
* Eight 1st-place & 25 top-3 awards of SigDA/CEDA EDA Contests