​報名網址：https://reurl.cc/bW9VdM​

Introduction of advanced semiconductor technology trends and TCAD simulations to support technology development

 About Micron: Manufacturing and operations
 Industry growth engine: AI
 Micron’s leading-edge technology to fuel AI
 AI implementation in Micron: Smart Manufacturing
 Careers Opportunities in Micron

Introduce Himax Wafer Level Optics (WLO) technology develop roadmap.

In the past, Himax WLO have succeed to design-in several new optical device.

Himax WLO integrate and combine optics and semiconductor process to create nano/micro-optical device.

In the future, it is the key technology to enable 3D sensing, AR/VR and HPC application

對抗全球暖化，達到2050淨零碳排里程碑，電源管理是關鍵重要的技術。本演講將探討電源IC的重要技術及市場應用趨勢。此外也將介紹亞洲類比IC龍頭大廠立錡科技，在加入全球手機晶片大廠聯發科技後的集團分工模式；以及未來在人工智慧，行動物聯網，電動車及大數據等未來世界科技潮流下，強強聯手的整體展望。

主講人: Dr. Sue Keay

演講題目：Australia’s National Robotics Strategy and AI as an enabling technology

時間: 2025/03/07 AM11:00-12:00
地點: 臺灣大學資訊工程學系101階梯教室
報名連結: https://forms.gle/JSYnFyagEthFJcmS

演講摘要：

Dr. Sue Keay led the development of Australia’s robotic future roadmap, which inspired Australia’s first National Robotics Strategy in June 2024.  Australia identifies artificial intelligence (AI) as an enabling tool for enhancing our use of robotic technology.  The Strategy calls on Australia to build world-leading ecosystems, strengthen industrial supply chains, ensure ethical development and use of AI and advanced robotic technologies, and support a more diverse workforce in AI and robotics.  How is robotics used in the Australian economy?  How do Australian researchers take R&D breakthroughs to commercialisation?  What is the role of AI for robotics and automation technologies?  These are the questions Dr Sue Keay hopes to share and learn from Taiwan’s experience. 

講者簡歷：

Dr. Sue Keay is one of Australia’s leading AI and robotics experts.  She is Director of the AI Institute at the University of New South Wales, and Adjunct Professor at Queensland University of Technology’s Centre for Robotics.  She is Founder and Chair of Robotics Australia Group.  Dr Keay is also a Fellow of the Australian Academy of Technology and Engineering (ATSE) and Member of the prestigious Kingston AI Group.  She was named a Superstar of STEM by Science & Technology Australia, and is widely known as an influential thought leader and champion of diversity. 

•Novatek Company Profile

•Evolution of Large Size Display Technology

•LCD Display and Design Challenge

•OLED Display and Compensation System

•LED Display System and Application Challenge

•Summary

Intel林崇勳資深處長將與各位分享「Advanced CMOS Technology Innovations for the Era of Artificial Intelligence」

歡迎有興趣的師長同學參加

Abstract:

We present a new angle on solving quantified linear integer arithmetic based on combining the automata-based approach, where numbers are understood as bitvectors, with ideas from (nowadays prevalent) algebraic approaches, which work directly with numbers. This combination is enabled by a fine-grained version of the duality between automata and arithmetic formulae. In particular, we employ a construction where states of automaton are obtained as derivatives of arithmetic formulae: then every state corresponds to a formula. Optimizations based on techniques and ideas transferred from the world of algebraic methods are used on thousands of automata states, which dramatically amplifies their effect. The merit of this combination of automata with algebraic methods is demonstrated by our prototype implementation being competitive to and even superior to state-of-the-art SMT solvers, in particular winning the first place in the NIA division of SMT-COMP'24 under the 24s scoring scheme and three second places in the division under different scoring schemes.

Bio:

智慧型手機出現後結合網際網路已深深的改變人們的生活習慣，透過網路結合電腦與各種機械設備，將逐漸形成自動化的各種應用，如智慧化生產、智慧化家庭、無人駕駛、遠距醫療與智慧化城市等等，而要建構此萬物聯網的環境，除了矽半導體晶片外，以三五族半導體材料製成的各種元件或晶片也扮演不可或缺的腳色。由於穩懋是一個生產各種三五族半導體產品的公司，在此演講中將介紹三五族半導體產品是如何改變我們的生活習慣。

​創鑫智慧公司-林永隆 董事長將與各位分享
「Development and applications of a memory-traffic-efficient convolution neural network」
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Recognizing where and when the slow slips occurred during earthquake cycle is critical for earthquake forecasting and hazard assessment. Abundant M ≥ 6 earthquakes and aseismic slip in a double-vergence suture in eastern Taiwan provides a rare opportunity to better understand the role of aseismic slip in the earthquake cycle deformation and triggering relationships. Through cataloguing repeating earthquake sequences (RES) and earthquake swarms in eastern Taiwan from 2000-2024, we found a sequential aseismic slip phenomena occurred 2.5 years preceding the 2024 Mw7.3 Hualien earthquake. The aseismic pre-slip was initiated by a 4-month-long active swarm activity in mid-2021 and followed by gradual increase of regional aseismic slip rate starting at the time of Mw6.1 event in June, 2022. Concurrent with elevated aseismic slip rate, the Central Range Fault was characterized by high seismicity rate until the 2024 Mw7.3 earthquake. The sequential seismic-aseismic interplay in the epicentral area of 2024 Hualien event provides the rare example of aseismic slip induced stress triggering toward the 2024 Mw7.3 earthquake.

最高法院-蘇素娥法官將與各位分享
「公益社會-國民法官法」
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此演講將分享闕博士在美國與台灣的求學與工作經驗，並探討AI與半導體行業的趨勢與大機會。

Abstract:

With the escalating demand of data-intensive applications such as artificial intelligence (AI) and high-performance computing (HPC), off-chip data transfer has become a critical bottleneck. To address this challenge, the data rate of wireline SerDes has surged beyond 200Gb/s. This presentation will delve into the evolving trends in wireline communication and explore state-of-the-art SerDes design techniques that are pushing the boundaries of data transfer rates.

​Abstract​

System-in-Package solutions, where multiple chiplets are integrated by 2.5D/3D package technologies, have become more and more popular. To be economically viable, they require carefully co-optimizing system demand and package technology as well as the interconnects that enable communication between chiplets. This forum talk covers advanced package technologies and new capabilities they enabled. Circuit techniques used for 2.5D and 3D stacking will be introduced, including mitigation of inter-symbol-interferences, cross-chiplet timing closure, shielding against crosstalks, and integrity of power delivery networks.

奇景光電徐正池 資深處長將與各位分享
「與EMC共存-以車載顯示晶片為例」
歡迎有興趣的師長同學一同參加~

Abstract

​Quantum computing devices are believed to solve computational problems that are infeasible for classical computers. As quantum technology advances, it becomes increasingly challenging to verify whether these devices behave correctly, particularly as they reach scales that rule out any classical simulation methods. This talk will cover verification in quantum computing through interactive protocols and formal methods. First, we will review the current state of research on interactively verifying whether quantum devices solve computational problems correctly, followed by applications of these interactive protocols. Then, we will explore approaches to verifying whether the descriptions of quantum algorithms behave as intended using techniques from formal methods.

​

臺大圖書館洪翠錨編審將與各位分享
「研究生不可不知的文獻搜尋方法」
歡迎有興趣的師長同學一同參加~

梁群健博士將與各位分享
「休閒園藝」
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大綱：

生成式人工智慧（AI）自2022年底引起廣泛關注以來，已經逐步成為日常生活的一部分。這類模型不僅在規模上年增數十倍，甚至數百倍，而且在架構上也從單一模型演化至多專家系統，展現出前所未有的多樣性和複雜性。隨著各行各業積極探索將生成式AI技術融入工作流程，資訊安全和系統可控性的問題日益受到重視。

然而，生成式AI技術的普及面臨著一個重大挑戰：高昂的部署成本。這一挑戰不僅限制了技術的廣泛應用，也成為了許多組織採用這類先進技術的障礙。對此，群聯公司推出了aiDAPTIV+方案，一項革命性的計劃，旨在通過利用NAND Flash技術擴充高帶寬記憶體（HBM），從根本上降低成本。這一策略不僅能夠提升系統性能，也使得生成式AI的部署成本大幅下降，從而推動技術的更廣泛應用。

The emergence of generative artificial intelligence (AI) at the end of 2022 marked a significant evolution, as these technologies increasingly integrate into daily human activities. The scale of generative models has been expanding annually at an exponential rate, with architecture advancements evolving from single-model frameworks to complex multi-expert systems. As industries across the board incorporate generative AI into their operational processes, concerns regarding information security and controllability have come to the forefront. However, the high deployment costs associated with generative AI technologies pose a significant barrier to widespread adoption. In response, Phison has introduced the aiDAPTIV+ initiative, a revolutionary approach that leverages NAND Flash to expand High Bandwidth Memory (HBM), thereby substantially reducing costs.

7/15週一下午2:00邀請IEEE Fellow陳彥光博士蒞臨專題演講，主題為:AI輔助的圖像處理器和編解碼器，地點於博理館201會議室，歡迎踴躍出席!!

報名請至:

https://forms.gle/ebD2NN1HbTMzLquu5

萬俊明導演將與各位分享
「臺灣草鴞與西拉雅鴞郎的旅程」
歡迎有興趣的師長同學一同參加~

北市消防局黃凱馡消防員將與各位分享
「火災與地震的應變」
歡迎有興趣的師長同學一同參加~

有球科技施懷勛創辦人將與各位分享

「台大電機到台灣職棒的Trial and Error」

歡迎有興趣的師長同學一同參加~

Abstract:

In recent years, the computing capability of the semiconductor chips is driven not only by the foundry process scaling to the most advanced nodes, but also by the advanced package that heterogeneously integrates chips made by their most competitive process.This growth of computing capability on the one hand enables AI algorithms to deliver their potential, on the other hand expedites novel algorithms to evolve and reach beyond human imagination.

One of the most important trends is to divide and win: using the chiplet approach.The SoC (System on Chip) approach used to put all functions, such as computing units (xPU), memory, logic, I/O, analog, power management etc, into one single chip and its foundry process using its IP.However as system complexity, cost, die size, and design cycle time approach the limits, integration of chiplet from various foundry processes by advanced package become the most cost effective way.In addition, advanced package allows topology of connection, memory integration, power integration into 2.5/3D and vertical, hence implement system that was not possible by single SoC alone.Today, many of the most advanced AI computing solutions are implemented by the chiplet approach, and are making differences in the cloud and edge computing and switching, and in many innovative AI enabled end devices.

Last but not least, power consumption requires for the AI computing becomes critical economically and environmentally for the human civilization as a whole.Advanced package integrates ever-efficient power delivery into the package and optimized at the system level, and allows ultra-low power optical chips be integrated into one single package.

演講內容簡介：

每天花了一整天的時間待在研究室，住處與學校兩點一線，睡前躺在床上還是擔心著自己的研究進度、或是明天meeting可能會面對的狀況，你的生活是這樣嗎？研究生生活並不容易，好好休息，才能走得更為安適與自在。本講座將從研究生可能面對的挑戰與壓力出發，思考可以如何在過程中「好好休息」，維持生活中的平衡並保持前進的動力。

踢可股份有限公司楊皓宇執行長將與各位分享

「AIx 死x 機器人」

歡迎有興趣的師長同學一同參加~

大綱：

台積公司為500個以上的客戶提供服務，生產超過10000 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品，不同的客戶產品代表的是不同的製造和設計支援。 過去三十幾年年來，台積公司，供應商，與我們的客戶形成一個大聯盟，不斷的創新，將各種想法付諸實現。講者將從TSMC晶片製造服務的現況出發，藉由元件模擬的角度，討論各種產品衍生的電路設計自動化需求，及其面對的挑戰及發展。也會針對高效能運算設計所需的模擬，探討在人工智慧和機器學習的幫助下，對於傳統電路模擬架構可能的突破。最後，在技術簡介之外，講者也會分享多年的職場經驗，鼓勵大家參與未來無限的可能。